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TP-Link Neffos X1 and X1 Max with metal body, Helio P10, fingerprint sensor announced

TP-Link has introduced Neffos X1 and X1 Max smartphones at the ongoing IFA this week. Both these have unibody metal design with 2.75mm narrow edges and 0.6-millimeter ultra-slim chamfer, are powered by MediaTek Helio P10 SoCs, run Android 6.0 (Marshmallow) and have a fingerprint sensor on the back to unlock the phone in 0.2 seconds. Both have … Continue reading "TP-Link Neffos X1 and X1 Max with metal body, Helio P10, fingerprint sensor announced"
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http://www.fonearena.com/blog/196130/tp-link-neffos-x1-and-x1-max-with-metal-body-helio-p10-fingerprint-sensor-announced.html

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